Numerical and Analytical Study on Bending Stiffness of Sandwich Panels at Ambient and Elevated Temperatures
This paper presents an investigation on the bending stiffness of sandwich panels at ambient and elevated temperatures. A finite element (FE) model is developed to verify simulations with experimental
results, and then a parametric study at different temperatures is carried out. After that, an analytical study to determine the bending stiffness at room temperatures according to the current specification is
conducted. Furthermore, the analytical solutions are developed to use at elevated temperatures. The objective of the current research is to compare the numerical and analytical results. It is observed that analytical solutions developed to evaluate the bending stiffness at elevated temperatures are conservative and reliable.