Numerical and Analytical Study on Bending Stiffness of Sandwich Panels at Ambient and Elevated Temperatures

This paper presents an investigation on the bending stiffness of sandwich panels at ambient and elevated temperatures. A finite element (FE) model is developed to verify simulations with experimental 
results, and then a parametric study at different temperatures is carried out. After that, an analytical study to  determine  the  bending  stiffness  at  room  temperatures  according  to  the  current  specification  is 
conducted. Furthermore, the analytical solutions are developed to use at elevated temperatures. The objective of the current research is to compare the numerical and analytical results. It is observed that analytical solutions developed  to  evaluate  the  bending  stiffness  at  elevated  temperatures  are conservative and reliable.